DTIC ADA223144: Development of Metastable Processing Paths pdf

DTIC ADA223144: Development of Metastable Processing Paths_bookcover

DTIC ADA223144: Development of Metastable Processing Paths

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The development of acceptable toughness and creep strength in high temperature intermetallic alloy matrices is closely related to the formation of proper distributions of second phase particles. Phases are needed both to arrest crack growth as low temperatures and to resist creep at high temperature intermetallic compounds has been investigated. In particular rapid solidification and/or rapid solid state quenching followed by controlled heat treatment can provide new and unusual microstructures of multiphase materials. This report describes research to: (a) develop an experimental basis and predictive models for solubility extension and metastable phase formation of intermetallic compounds by rapid solidification, (b) analyze the kinetics of decomposition of metastable phases involving ordering and (c) improve the phase diagram modeling of systems involving ordered phases. Keywords: Intermetallics, Ti/Nb Aluminides, Phase diagram, Rapid solidification, Ternary alloys, Solid state quenching

  • Creator/s: Defense Technical Information Center
  • Date: 6/15/1990
  • Year: 1990
  • Book Topics/Themes: DTIC Archive, Boettinger, William J, NATIONAL INST OF STANDARDS AND TECHNOLOGY GAITHERSBURG MD METALLURGY DIV, *INTERMETALLIC COMPOUNDS, *HEAT RESISTANT ALLOYS, MICROSTRUCTURE, PREDICTIONS, MODELS, MATERIALS, PROCESSING, HIGH TEMPERATURE, PATHS, TOUGHNESS, SOLIDIFICATION, ALLOYS, PHASE, QUENCHING, HEAT TREATMENT, CRACK PROPAGATION, PARTICLES, CREEP, SOLUBILITY, TERNARY COMPOUNDS, DECOMPOSITION, METASTABLE STATE, PHASE DIAGRAMS, ALUMINIDES, CREEP STRENGTH, QUICK REACTION, CONTROL, LOW TEMPERATURE

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