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Book Title: DTIC ADA250784: Interfacial Studies of Refractory Glass
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Book Category: CARBON
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Language: english
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Post Date: 2025-04-15 13:38:16
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PDF Size: 3.52 MB
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Book Pages: 76
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DTIC ADA250784: Interfacial Studies of Refractory Glass
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Description of the Book:
The main objective of this program is to characterize the chemistry and structure of new advanced small diameter silicon based fibers and how these factors influence the nature of the fiber/matrix interface in refractory glass-ceramic matrix composites. It is the nature of this interface that then determines to a great degree the composite thermal, environmental, and mechanical properties. The fibers under investigation during the second year of this program included the new experimental polymer derived crystalline SiC fibers from Dow Corning Corp., the Si-N-C-O ‘Black’ fibers from Textron Specialty Materials, as well as the new low oxygen radiation cured Nicalon SiC type fibers from Nippon Carbon Co. Since the availability of all of these fibers was extremely limited, emphasis was placed on the mechanical, chemical, and microstructural characterization of the fibers through tensile testing, SEM of fiber fracture characteristics, scanning Auger depth profiling of fiber surfaces, and TEM of fiber thin sections, as well as their fracture behavior, bonding characteristics, and interfacial compatibility with various glass-ceramic matrix materials.
Results of these analyses are discussed. Crystalline SiC fibers, Textron ‘Black’ fibers, low oxygen Nicalon fibers, SiC fiber/glass-ceramic matrix interfaces, TEM fiber analyses
- Creator/s: Defense Technical Information Center
- Date: 4/30/1992
- Year: 1992
- Book Topics/Themes: DTIC Archive, Brennan, John J, UNITED TECHNOLOGIES RESEARCH CENTER EAST HARTFORD CT, *INTERFACES, *CERAMIC MATRIX COMPOSITES, *FIBERS, *SILICON, *GLASS, *MATRIX MATERIALS, *SILICON CARBIDES, STRUCTURES, COMPATIBILITY, CARBON, DEPTH, SURFACES, OXYGEN, CHEMISTRY, AVAILABILITY, BONDING, BEHAVIOR, AUGERS, POLYMERS, MATERIALS, CHEMICALS, MECHANICAL PROPERTIES, RADIATION, DIAMETERS, SCANNING, THERMAL PROPERTIES
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