DTIC ADA432262: Robust, Reliable, Radio Frequency (RF pdf

DTIC ADA432262: Robust, Reliable, Radio Frequency (RF

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Description of the Book:

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.1 dB package insertion loss up through 110 GHz and accounts for only 28 % of the total packaged RF MEMS circuit cost. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages

• Creator/s: Defense Technical Information Center
• Date: 1/1/2005
• Year: 2005
• Book Topics/Themes: DTIC Archive, Goldsmith, Charles L, MEMTRONICS PLANO TX, *MICROELECTROMECHANICAL SYSTEMS, LOW COSTS, MICROWAVE EQUIPMENT, WAFERS, RADIOFREQUENCY

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